TC646BEOA - Microchip Technology

Manufacturer Part Number

TC646BEOA

Manufacturer

Microchip Technology

Introduction

The TC646BEOA is a motor driver and controller component tailored for power management and specifically designed to support brushless DC (BLDC) motor control applications.

Product Features and Performance

Supports BLDC motors

Integrated FanSense™ technology for fan status monitoring

Speed controller functionality

Pre-Driver circuit configured for low-side output

Interface compatibility with parallel communication

Operational in a supply voltage range of 3V to 5.5V

Able to function in temperatures ranging from -40°C to 85°C

Surface mount 8-SOIC package for ease of integration onto PCBs

Product Advantages

Enhanced reliability with built-in FanSense™ diagnostics

Flexibility in motor control applications with parallel interface

Optimized for low-power consumption with 3V to 5.5V operational range

Robust thermal performance suitable for various environmental conditions

Key Technical Parameters

Packaging type: Tube

Series: FanSense™

Product status: Active

Voltage supply range: 3V to 5.5V

Operating temperature range: -40°C to 85°C

Mounting type: Surface Mount

Package: 8-SOIC

Quality and Safety Features

Robust temperature range ensuring stable operation under extreme conditions

Complies with industry-standard quality and safety regulations

Compatibility

Compatible with various BLDC motor applications requiring a pre-driver

Application Areas

Ideal for Fan Controller systems within electronic devices

Product Lifecycle

Active product with ongoing manufacturer support

Continued availability of replacements or upgrades is expected

Several Key Reasons to Choose This Product

Integrated FanSense™ technology for reliable fan operation monitoring

Low-Side output pre-driver allows for effective motor control schemes

Parallel interface grants easy integration with existing system architecture

Wide operating voltage and temperature range enhance device versatility

Surface mount package aligns with modern PCB assembly processes