Manufacturer Part Number
SY89833ALMG-TR
Manufacturer
microchip-technology
Introduction
The SY89833ALMG-TR is a precision-engineered fanout buffer and translator designed for high-speed clock/timing applications, offering advanced performance and reliability.
Product Features and Performance
Advanced fanout buffer and translator technology
Supports a wide range of input types: CML, LVDS, LVPECL
High maximum frequency capability up to 2 GHz for enhanced signal processing
Low voltage supply range from 3V to 3.6V, optimizing power consumption
Durable construction for operation in temperatures ranging from -40°C to 85°C
Surface mount technology for compact and efficient board design
Product Advantages
High flexibility with support for multiple input types
Increased system reliability through precision performance and durable construction
Efficient power consumption suited for sensitive applications
Compact size enables more efficient use of board space
Key Technical Parameters
Number of Circuits: 1
Ratio Input:Output: 1:4
Differential Input:Output: Yes/Yes
Input: CML, LVDS, LVPECL
Output: LVDS
Frequency Max: 2 GHz
Voltage Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad, 16-MLF®
Quality and Safety Features
Manufactured under strict quality control measures
Ensures safe operation within specified temperature and power supply ranges
Compatibility
Designed for broad compatibility with clock/timing systems requiring LVDS outputs and supporting CML, LVDS, LVPECL inputs
Application Areas
Network infrastructure
High-speed computing systems
Telecommunication equipment
Data centers and storage systems
Product Lifecycle
Status: Active
Product is not nearing discontinuation, with ongoing support and availability
Several Key Reasons to Choose This Product
Leading-edge fanout buffer and translator technology for high-performance applications
Broad compatibility enhances system design flexibility
High-frequency capability supports advanced clock/timing functions
Energy-efficient operation reduces overall system power demand
Robust design ensures reliability in a wide range of operating conditions
Surface mount package streamlines manufacturing and assembly processes