Manufacturer Part Number
PM8310A-FEI
Manufacturer
Microchip Technology
Introduction
Telecom framer interface for serial and TDM data transmission
Product Features and Performance
Supports 4-Wire, Serial, TDM interfaces
Integrates with one circuit
Can be used within an operating temperature range of -40°C to 85°C
Surface mount 896-BGA, FCBGA package for robust PCB assembly
Product Advantages
Designed for high reliability and durability in telecom applications
Optimized for interface applications requiring high-speed data framing
Key Technical Parameters
896-FCBGA (31x31) supplier device package dimension
Operates without the need for a specific supply voltage
Tolerant to a wide range of operating temperatures
Quality and Safety Features
Meets industry standards for telecom interface components
Constructed to withstand harsh industrial environments
Compatibility
Compatible with telecommunications standards
Suitable for use with systems requiring serial and time-division multiplexing (TDM) communication protocols
Application Areas
Telecommunications systems
Data networking equipment
Interface modules for high-speed data transmission
Product Lifecycle
Active product status, not nearing discontinuation
Availability of replacements and upgrades as per Microchip Technology's product support
Reasons to Choose This Product
High-performance telecom interface with robust data framing capabilities
Ability to operate in extreme temperatures, ensuring reliability in various environments
From a reputable manufacturer with a commitment to quality and long-term support
Surface mount technology facilitates the integration into a range of telecom equipment
The product line, PM8310, has a strong market presence with proven performance