Manufacturer Part Number
PIC18F26K20-I/SS
Manufacturer
Microchip Technology
Introduction
The PIC18F26K20-I/SS is an 8-bit microcontroller from Microchip Technology's PIC® XLP™ 18K series, designed for low-power, high-performance applications.
Product Features and Performance
Core Processor: PIC
Core Size: 8-Bit
Speed: 64MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number of I/O: 24
Program Memory Size: 64KB (32K x 16)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 3.8K x 8
Voltage Supply Range: 1.8V to 3.6V
Data Converters: A/D 11x10b
Oscillator Type: Internal
Operating Temperature Range: -40°C to 85°C
Product Advantages
High operating speed at 64MHz allows for efficient processing and task management.
Enhanced connectivity with I2C, SPI, UART/USART interfaces for easy integration.
Extensive peripheral support improves system reliability and functionality.
Low power consumption with PIC® XLP™ technology for energy-sensitive projects.
Key Technical Parameters
Core Size: 8-Bit
Speed: 64MHz
Program Memory: 64KB FLASH
EEPROM Size: 1K x 8
RAM Size: 3.8K x 8
Operating Voltage: 1.8V ~ 3.6V
Quality and Safety Features
Brown-out Detect/Reset and POR for improved system reliability.
HLVD (High/Low-Voltage Detection) ensures stable operation under variable voltages.
Compatibility
Surface Mount 28-SSOP package ensures compatibility with standard SMT assembly processes.
Application Areas
Industrial Automation
Consumer Electronics
Automotive Systems
IoT Devices
Product Lifecycle
Status: Active
This product is not nearing discontinuation and replacements or upgrades are readily available.
Several Key Reasons to Choose This Product
High-speed 8-bit performance suitable for a broad range of applications.
Low power consumption makes it ideal for battery-operated devices.
Extensive connectivity options enable versatile system design.
Robust set of peripherals enhances overall system capabilities.
Wide operating temperature range supports use in challenging environments.
Easily integrated into various designs with its surface mount packaging.