Manufacturer Part Number
PIC16LF1939T-I/ML
Manufacturer
Microchip Technology
Introduction
8-bit microcontrollers designed for power efficiency and performance, part of the PIC® XLP™ 16F series.
Product Features and Performance
Core Processor: PIC
Core Size: 8-Bit
Speed: 32MHz
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number of I/O: 36
Program Memory Size: 28KB (16K x 14)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 1K x 8
Oscillator Type: Internal
Product Advantages
Enhanced power efficiency facilitated by PIC XLP technology
Comprehensive set of peripherals for versatile use
Wide range of connectivity options for various applications
Substantial program memory and RAM for complex programs
Key Technical Parameters
Voltage Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 14x10b
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Supplier Device Package: 44-QFN (8x8)
Package / Case: 44-VQFN Exposed Pad
Quality and Safety Features
Extended temperature range for reliability across different environments
Brown-out Detect/Reset for improved system-level safety
Compatibility
Variety of interfaces for easy integration with other devices and systems
Conformance to industry-standard QFN package for compatibility with standard PCB layouts
Application Areas
Consumer Electronics
Automotive Systems
Industrial Control
Home Automation
Internet of Things (IoT) Devices
Product Lifecycle
Product Status: Active
Continued manufacturer support with no current mention of discontinuation
Availability of replacements or upgrades not specified
Key Reasons to Choose This Product
High computational speed with a 32MHz PIC core
PIC XLP (Extreme Low Power) technology ensures energy efficiency for battery-powered applications
Extensive peripheral set supports complex functionalities within a single chip
Wide operational voltage range suitable for a variety of power supplies
Broad connectivity options offer flexibility in system design
Large memory capacity enables sophisticated firmware and application code
Surface mount QFN package optimizes board space for compact designs
Suitable for harsh operational environments due to its industrial-grade temperature tolerance