PIC16F1827-I/SS - Microchip Technology

Manufacturer Part Number

PIC16F1827-I/SS

Manufacturer

microchip-technology

Introduction

The PIC16F1827-I/SS from Microchip Technology is an embedded microcontroller featuring XLP mTouch technology suitable for various embedded applications.

Product Features and Performance

Core Processor: PIC

Core Size: 8-Bit

Speed: 32MHz

Connectivity: I2C, SPI, UART/USART

Peripherals: Brown-out Detect/Reset, Power-on Reset, PWM, Watchdog Timer

Number of I/O: 16

Program Memory Size: 7KB (4K x 14)

Program Memory Type: FLASH

EEPROM Size: 256 x 8

RAM Size: 384 x 8

Voltage Supply: 1.8V to 5.5V

Data Converters: A/D 12x10b

Oscillator Type: Internal

Operating Temperature Range: -40°C to 85°C

Mounting Type: Surface Mount

Packaging: 20-SSOP

Product Advantages

Low power consumption with XLP technology

High integration with multiple communication interfaces

Robust operational stability in extreme temperatures

High memory capacity supporting complex programs and data storage

Key Technical Parameters

Core Size: 8-Bit

Speed: 32MHz

Program Memory: 7KB

EEPROM Size: 256 x 8

RAM Size: 384 x 8

Operating Temperature: -40°C to 85°C

Voltage Supply Range: 1.8V to 5.5V

Quality and Safety Features

Brown-out Detect/Reset ensures proper operation under fluctuating power

Watchdog Timer helps in maintaining system integrity

Robust temperature range for operation in harsh environments

Compatibility

Compatible with I2C, SPI, and UART/USART communication protocols

Surface Mount package aligns with modern PCB design standards

Application Areas

Consumer Electronics

Automotive

Internet of Things (IoT)

Industrial Control

Product Lifecycle

Status: Active

Not nearing discontinuation with replacements and upgrades readily available

Several Key Reasons to Choose This Product

Low power operation with XLP technology minimizes energy consumption

High connectivity options with I2C, SPI, UART/USART facilitate versatile design implementations

Extensive programmable memory options adapt to various complex applications

Robust build quality suitable for demanding temperature conditions

Comprehensive peripheral integration reduces additional component needs