PIC16F1705T-I/SL - Microchip Technology

Manufacturer Part Number

PIC16F1705T-I/SL

Manufacturer

Microchip Technology

Introduction

The PIC16F1705T-I/SL is a part of the high-performance PIC® XLP™ 16F series of embedded microcontrollers designed for low-power applications.

Product Features and Performance

8-Bit Core Processor PIC

Speed of 32MHz

Connectivity options include I2C, LINbus, SPI, UART/USART

Peripherals like Brown-out Detect/Reset, POR, PWM, WDT

12 I/O pins for versatile interfacing

Program Memory Size of 14KB (8K x 14)

FLASH program memory type

RAM Size of 1K x 8 for data processing

Internal Oscillator for system clock

Data Converters feature A/D 8x10b and D/A 1x8b for analog interfacing

Product Advantages

Low Power Consumption with XLP technology

Enhanced peripheral set for increased functionality

High-speed 32MHz operation for improved processing speed

Flexible connectivity options for various communication protocols

Robust temperature range of -40°C ~ 85°C suitable for harsh environments

Key Technical Parameters

Supply Voltage Range: 2.3V ~ 5.5V

Operating Temperature: -40°C ~ 85°C

Program Memory: 14KB FLASH

Data Converters: A/D 8x10b, D/A 1x8b

Package: 14-SOIC (0.154", 3.90mm Width)

Quality and Safety Features

Extended temperature range ensures reliability in varying conditions

Brown-out Detect/Reset provides protection against voltage dips

Watchdog Timer (WDT) for system stability and recovery

Compatibility

Compatible with a wide range of interface standards including I2C, SPI, and UART

Surface Mount 14-SOIC package for standard PCB assembly

Application Areas

Low-power embedded applications

Industrial control systems

Automotive electronics

Internet of Things (IoT) devices

Consumer electronics

Product Lifecycle

Active Product Status indicates ongoing manufacturing and support

Not nearing discontinuation and replacements or upgrades are available

Several Key Reasons to Choose This Product

Extensive connectivity options cater to a broad range of applications

XLP technology for energy efficiency, extending battery life in portable devices

High integration of features reduces BOM cost and PCB space

Scalable and upgradeable within the Microchip product family

Active product lifecycle status ensures long-term availability and support.