PIC16F15376-I/MV - Microchip Technology

Manufacturer Part Number

PIC16F15376-I/MV

Manufacturer

Microchip Technology

Introduction

The PIC16F15376-I/MV is a high-performance 8-bit microcontroller from Microchip Technology's PIC® XLP™ 16F series, designed for advanced control applications.

Product Features and Performance

Core Processor: PIC

Core Size: 8-Bit

Speed: 32MHz

Connectivity: I2C, LINbus, SPI, UART/USART

Peripherals: Brown-out Detect/Reset, Power-on Reset, PWM, Watchdog Timer

Number of I/O: 36

Program Memory Size: 28KB (16K x 14)

Program Memory Type: FLASH

Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V

Data Converters: A/D 35x10b, D/A 1x5b

Oscillator Type: Internal

Operating Temperature: -40°C ~ 85°C

Mounting Type: Surface Mount

Package: 40-UQFN (5x5)

Product Advantages

Highly configurable for various control applications

Advanced connectivity options

Equipped with numerous peripherals to facilitate system management and enhance performance

Supports a broad range of supply voltages for versatile use in different environments

Key Technical Parameters

Core Processor: PIC, 8-Bit

Speed: 32MHz

Program Memory: 28KB FLASH

Operating Voltage: 2.3V to 5.5V

I/O Count: 36

Analog-to-Digital Converter: 35 channels, 10-bit

Operating Temperature Range: -40°C to 85°C

Quality and Safety Features

Brown-out Detect/Reset

Power-on Reset

Extended operating temperature range ensures reliability in harsh conditions

Compatibility

Compatible with various communication protocols including I2C, LINbus, SPI, UART/USART

Adaptable to a range of peripheral devices with extensive I/O capabilities

Application Areas

Industrial automation

Consumer electronics

Automotive systems

Internet of Things (IoT) devices

Product Lifecycle

Status: Active

This product is active with no current indication of discontinuation. Upgrades and replacements are available for future scalability.

Several Key Reasons to Choose This Product

Versatile connectivity options cater to diverse application needs

Robust I/O capabilities allow for extensive peripheral interfacing

Optimized power management features enhance energy efficiency

Stable operation ensured across a wide range of temperatures and power supply conditions

Compact, surface mount package suitable for space-constrained applications