MIC4605-1YMT-TR - Microchip Technology

Manufacturer Part Number

MIC4605-1YMT-TR

Manufacturer

Microchip Technology

Introduction

MIC4605-1YMT-TR is a high-performance half-bridge gate driver, designed specifically for Power Management applications, offering precise control and efficient operation of N-Channel MOSFET gates.

Product Features and Performance

Independent half-bridge driver configuration

Supports two N-channel MOSFET gates

Peak output current of 1A (source and sink)

Integrated TTL, non-inverting input logic

Fast rise and fall times of 20ns each for quick switching

High bootstrap voltage capacity up to 108V

Wide operating temperature range from -40°C to 125°C

Product Advantages

Enhanced power efficiency and reliability

High voltage capacity suitable for various high voltage applications

Robust thermal performance ensures stability across diverse operating conditions

Compact 10-UFDFN exposed pad package supports space-sensitive applications

Key Technical Parameters

Voltage Supply: 5.5V ~ 16V

Logic Voltage VIL, VIH: 0.8V, 2.2V

Current Peak Output (Source, Sink): 1A, 1A

High Side Voltage Max (Bootstrap): 108 V

Rise / Fall Time (Typ): 20ns, 20ns

Operating Temperature: -40°C ~ 125°C (TJ)

Quality and Safety Features

Stringent quality testing for consistent performance

Built-in safety features to prevent overcurrent and overheating

Compatibility

Compatible with a wide range of N-channel MOSFETs

Suitable for TTL and non-inverting input types

Application Areas

Motor drivers

Power supply regulation

High voltage switching applications

Product Lifecycle

Currently active product status

Not known to be nearing discontinuation

Replacement and upgrade options available as technology advances

Several Key Reasons to Choose This Product

High-speed switching capabilities enhance overall efficiency

The ability to handle high voltages expands usability in numerous applications

Tight rise and fall times provide precise control over power transitions

Robust temperature tolerance ensures reliable performance under extreme conditions

Small and efficient packaging is optimal for compact circuit designs