Manufacturer Part Number
MD1822K6-G
Manufacturer
Microchip Technology
Introduction
High-performance Power Management Integrated Circuit (PMIC) Gate Driver
Product Features and Performance
Four Independent Gate Drivers
Configured for Half-Bridge Topologies
Compatible with both N-Channel and P-Channel MOSFET Gates
Supply Voltage Range from 5V to 10V
Logic Voltage Thresholds - VIL at 0.3V and VIH at 1.7V
Peak Output Current of 2A for both Sourcing and Sinking
Input Types include both Inverting and Non-Inverting
Fast Rise and Fall Times Typically at 7ns
Supports Operating Temperatures from -20°C to 125°C
Product Advantages
Optimized for high-speed switching applications
Enhanced power efficiency
Robust thermal performance
Space-saving 16-VFQFN Exposed Pad package
Ease of design with logic-compatible voltage levels
High output current capability for driving large MOSFETs
Key Technical Parameters
Supply Voltage Range: 5V ~ 10V
Logic Voltage: VIL at 0.3V, VIH at 1.7V
Peak Output Current: 2A (Source/Sink)
Rise / Fall Time: 7ns typical
Operating Temperature Range: -20°C ~ 125°C
16-QFN Package for compact PCB layouts
Quality and Safety Features
Built to withstand rigorous industrial temperature ranges
Qualification standards compliant with industry specifications
Compatibility
Suitable for Surface Mount Technology (SMT)
Designed for driving N-Channel and P-Channel MOSFETs
Logic inputs compatible with standard CMOS and TTL levels
Application Areas
DC-DC Converters
Motor Controllers
Power Supply Units
Electronic Switching Systems
High-Frequency Power Circuits
Product Lifecycle
Status: Active
Not flagged for discontinuation
Replacements or upgrades may exist for future advancements
Several Key Reasons to Choose This Product
Efficient Power Management in multi-MOSFET environments
High current driving capability tailored for demanding applications
Precision switching with fast rise and fall times for improved performance
Robust design facilitating long-term reliability in industrial applications
Wide operating temperature suitable for diverse environmental conditions
Space-efficient packaging enabling dense circuit designs
Backed by Microchip Technology's support and reliability
