MCP2003A-E/SN - Microchip Technology

Manufacturer Part Number

MCP2003A-E/SN

Manufacturer

microchip-technology

Introduction

The MCP2003A-E/SN is a LINbus transceiver designed by Microchip Technology, catering to applications requiring reliable data communication in automotive environments.

Product Features and Performance

LINbus protocol support for automotive applications.

Single driver/receiver ensures efficient data transmission.

Half duplex communication facilitates controlled data flow.

Receiver Hysteresis of 175 mV enhances signal stability.

Designed to operate within a wide voltage range of 6V to 27V.

Capable of withstanding operating temperatures from -40°C to 125°C.

Surface mount 8-SOIC packaging for compact integration.

Product Advantages

High reliability in harsh automotive conditions.

Efficient power usage within a broad supply voltage range.

Enhanced data integrity through receiver hysteresis.

Wide temperature range caters to various environmental conditions.

Compact form factor for space-sensitive applications.

Key Technical Parameters

Protocol: LINbus

Number of Drivers/Receivers: 1/1

Duplex: Half

Receiver Hysteresis: 175 mV

Voltage Supply: 6V to 27V

Operating Temperature: -40°C to 125°C

Mounting Type: Surface Mount

Package / Case: 8-SOIC

Quality and Safety Features

Built to endure extreme environmental conditions found in automotive applications.

Tested for reliable data communication over LINbus networks.

Compatibility

Compatible with LINbus protocol applications.

Surface mountable in a variety of PCB designs.

Application Areas

Automotive communication systems.

Industrial control units.

Networking for sensor data within vehicles.

Product Lifecycle

This product is currently active with no immediate risk of discontinuation.

Long-term availability is supported, with replacements or upgrades not currently required.

Several Key Reasons to Choose This Product

Robust performance under extreme conditions highlights reliability.

Adaptive to varying voltage levels, ensuring operability across systems.

The compact, surface mount design facilitates easy integration into existing designs.

Offers stable data transmission, minimizing errors in communication networks.

Supported by Microchip Technology, ensuring consistent quality and product support.