MCP16501TD-E/RMB - Microchip Technology

Manufacturer Part Number

MCP16501TD-E/RMB

Manufacturer

Microchip Technology

Introduction

The MCP16501TD-E/RMB is a power management integrated circuit (PMIC) designed to support processor applications with specialized power requirements.

Product Features and Performance

Supply Current of 14mA

Supports Voltage range from 2.7V to 5.5V

Operating Temperature range from -40°C to 125°C

Surface Mount Technology for PCB assembly

24-VFQFN Exposed Pad for efficient heat dissipation

Comes in a compact 24-VQFN (4x4) package

Product Advantages

High-temperature operational stability

Versatile supply voltage compatibility

Precise power management tailored for processors

Efficient thermal management with exposed pad design

Robust design for longevity and reliable performance

Key Technical Parameters

Current - Supply: 14mA

Voltage - Supply: 2.7V to 5.5V

Operating Temperature: -40°C to 125°C

Mounting Type: Surface Mount

Package / Case: 24-VFQFN Exposed Pad

Supplier Device Package: 24-VQFN (4x4)

Quality and Safety Features

Built to meet stringent quality standards

Designed for high reliability and safety in power management

Thermal protection features for device longevity

Compatibility

Engineered specifically for processor applications

Adaptable to a range of voltage requirements

Suitable for surface mount technology assembly processes

Application Areas

Power management for processors in embedded systems

Industrial and automation control systems

Automotive electronics

Consumer electronics

Telecommunications equipment

Product Lifecycle

Status: Active

Regularly stocked, ongoing manufacturing support

No current indication of discontinuation

Options for future upgrade or replacement available

Several Key Reasons to Choose This Product

Optimized for processor power supply regulation, ensuring stable and reliable performance

Broad operating temperature range suitable for harsh environments

Flexible power supply voltage compatibility allows for use in a variety of system designs

Space-saving design with surface mount package to fit compact electronics

24-VFQFN package with Exposed Pad enhances thermal performance

Proactive lifecycle management with a commitment to long-term availability