MCP1640BT-I/MC - Microchip Technology

Manufacturer Part Number

MCP1640BT-I/MC

Manufacturer

Microchip Technology

Introduction

The MCP1640BT-I/MC is a high-performance, compact DC-DC boost converter with adjustable output designed for power management applications.

Product Features and Performance

Boost topology enabling voltage step-up

Adjustable output voltage from 2V to 5.5V

Input voltage range from 0.8V to 5.5V

Maximum output current of 350mA

High switching frequency of 500kHz for efficient operation

Supports synchronous rectification

Operating temperature range from -40°C to 125°C

Surface mount 8-VFDFN exposed pad package for compactness

Product Advantages

High efficiency boosting of low voltage sources

Flexibility in applications due to adjustable voltage output

Suitable for battery-operated devices with its low input voltage capability

Enhanced thermal performance with exposed pad package

Key Technical Parameters

Voltage Input (Min): 0.8V

Voltage Input (Max): 5.5V

Voltage Output (Min/Fixed): 2V

Voltage Output (Max): 5.5V

Current Output: 350mA

Frequency Switching: 500kHz

Operating Temperature: -40°C ~ 125°C (TJ)

Quality and Safety Features

Overheat protection within the operating temperature range

Built-in safeguards against current overloads

Compatibility

Compatible with a variety of capacitive, inductive, and resistive loads

Suitable for use in multi-stage power conversion architectures

Application Areas

Battery-powered devices

Portable electronics

Energy harvesting systems

IoT devices

Product Lifecycle

Currently active product status

Consistently updated and optimized for market relevance

No near-future discontinuation expected

Several Key Reasons to Choose This Product

High efficiency and low-voltage operation suit modern power-sensitive applications

Adaptive output voltage maximizes application compatibility

Robust design suitable for demanding environments up to 125°C

Compact 8-DFN package ideal for space-constrained applications

High switching frequency minimizes external component sizes, reducing overall design footprint