Manufacturer Part Number
LE9622RQCT
Manufacturer
Microchip Technology
Introduction
The microchip-technology LE9622RQCT is a telecom interface component from the miSLIC™ series, optimized for subscriber line interface applications.
Product Features and Performance
Subscriber Line Interface Concept (SLIC) functionality
PCM and SPI interface support
Single circuit integration
Compatible with 1.8V, 2.5V, 3.3V supply voltages
Designed for surface mount technology
Robust operating temperature range from -40°C to 85°C
53-VFQFN Exposed Pad package for enhanced thermal dissipation
Product Advantages
Simplifies design efforts for telecom interfaces
Flexible power supply compatibility
Can be easily integrated into existing systems through SPI or PCM
Compact form factor
Can operate in harsh temperature environments
Highly integrated solution reducing external component requirement
Key Technical Parameters
Function: SLIC
Interface: PCM, SPI
Number of Circuits: 1
Voltage Supply: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 53-VFQFN Exposed Pad
Supplier Device Package: 53-QFN (7x7)
Base Product Number: LE9622
Quality and Safety Features
Manufactured by Microchip Technology, a trusted industry leader
Compliant with telecom industry standards for safety and performance
Thoroughly tested over the specified temperature range
Compatibility
Compatible with standard surface mount processes
Interfacing capabilities with PCM and SPI protocols
Application Areas
Telecommunication equipment
Embedded systems for voice communications
VoIP systems
PBX Systems
Product Lifecycle
Status: Active
Microchip Technology regularly updates product lines, but no known discontinuation for this model
Replacements or upgrades may be offered in the miSLIC™ series
Several Key Reasons to Choose This Product
State-of-the-art integration by a reputable manufacturer
The highly adaptive interface caters to multiple telecom standards
Enhanced power supply range catering to varied design requirements
Durable and reliable over a wide temperature spectrum
Compact packaging ideal for space-sensitive applications
Easy to mount and integrate into telecom systems
Full compliance with industry standards ensuring longevity and interoperability