KSZ8567RTXI-TR - Microchip Technology

Manufacturer Part Number

KSZ8567RTXI-TR

Manufacturer

Microchip Technology

Introduction

The KSZ8567RTXI-TR is an Ethernet switch interface controller designed for networked devices.

Product Features and Performance

Supports Ethernet protocol for network communication

Integrated switch functionality to connect multiple network devices

I2C and SPI interface options for configuration and management

Compliant with 10/100 Base-T PHY standards, enabling up to 100Mbps network speeds

Multi-voltage support: 1.8V, 2.5V, 3.3V supply levels

Robust operating temperature range from -40°C to 85°C suitable for industrial environments

Product Advantages

Flexible interfacing with support for both I2C and SPI

Supports various supply voltage levels for compatibility with different logic levels

Designed for high-temperature industrial applications

Key Technical Parameters

Voltage - Supply: 1.8V, 2.5V, 3.3V

Operating Temperature: -40°C to 85°C

Package / Case: 128-TQFP Exposed Pad

Supplier Device Package: 128-TQFP-EP (14x14)

Protocol: Ethernet

Function: Switch

Quality and Safety Features

Designed to meet industry standards for network communication

Robust construction with 128-TQFP Exposed Pad package for improved thermal performance

Compatibility

Multiple voltage supply compatibility ensures functionality with a range of device logic levels

Standard compliance with 10/100 Base-T PHY for wide network compatibility

Application Areas

Used in networked industrial control systems

Ideal for embedded systems requiring network connectivity

Suitable for Internet of Things (IoT) devices and smart home networks

Product Lifecycle

Status: Active (not nearing discontinuation)

Availability of replacements or upgrades is generally ensured for active products

Several Key Reasons to Choose This Product

Supports critical network standards and is future-proof for new network installations

Provides interface flexibility with I2C and SPI support

Suitable for harsh industrial environments due to its wide operating temperature range

Supplied in tape and reel packaging for automated assembly processes

Developed by Microchip Technology, a trusted manufacturer in the electronics industry

Enhanced thermal management with the exposed pad TQFP package, ensuring reliable performance under load