EQCO875SC.3-HS - Microchip Technology

Manufacturer Part Number

EQCO875SC.3-HS

Manufacturer

microchip-technology

Introduction

High-speed interface chip designed for camera connectivity solutions, providing robust signal integrity over long cable distances.

Product Features and Performance

High-speed data transmission capability

Optimized for camera interface applications

Supports 3.3V power supply for integration flexibility

Compact 16-VQFN Exposed Pad package for space-saving design

Surface mount technology for solid board-level integration

Product Advantages

Suited for embedded camera systems requiring long-distance data transmission

Integrated features reduce external component needs

Designed for high-speed performance and signal reliability

Key Technical Parameters

Supply Voltage: 3.3V

Package Type: 16-VQFN Exposed Pad

Mounting Type: Surface Mount

High-speed interface specialized function

Quality and Safety Features

Constructed in compliance with Microchip's manufacturing standards

Reliable performance backed by industry use

Compatibility

Specifically designed for camera applications

May require specific supporting circuitry for optimal functionality

Application Areas

Mainly used in camera systems requiring stable, high-speed data connectivity

Product Lifecycle

Obsolete status, meaning it is no longer being manufactured

Alternative solutions or upgrades may be available from Microchip Technology

Several Key Reasons to Choose This Product

High-speed data transmission enhances camera system performance

Robust signal integrity suitable for various operating environments

Compact size facilitates use in space-constrained applications

Surface mount design for efficient PCB assembly processes

Backed by Microchip Technology's reputation for quality and reliability