DSPIC33FJ32GP302-I/SO Tech Specifications
Microchip Technology - DSPIC33FJ32GP302-I/SO technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - DSPIC33FJ32GP302-I/SO

Product Attribute	Attribute Value
Manufacturer	Microchip Technology
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V
Supplier Device Package	28-SOIC
Speed	40 MIPs
Series	dsPIC™ 33F
RAM Size	4K x 8
Program Memory Type	FLASH
Program Memory Size	32KB (32K x 8)
Peripherals	Brown-out Detect/Reset, DCI, DMA, I²S, POR, PWM, WDT
Package / Case	28-SOIC (0.295", 7.50mm Width)
Package	Tube

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	21
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 10x10b/12b
Core Size	16-Bit
Core Processor	dsPIC
Connectivity	I²C, IrDA, LINbus, SPI, UART/USART
Base Product Number	DSPIC33FJ32GP302

Parts Introduction

Manufacturer Part Number

DSPIC33FJ32GP302-I/SO

Manufacturer

Microchip Technology

Introduction

High-performance 16-bit Digital Signal Controller

Product Features and Performance

16-Bit dsPIC Core

40 MIPS Performance

32KB Flash Memory

4KB SRAM

21 Digital I/O Pins

10x10b/12b Analog-to-Digital Converters

Product Advantages

Advanced Digital Signal Processing capabilities

High-Speed CPU for complex algorithms

Flexible on-chip peripherals for versatile applications

Low power consumption

Key Technical Parameters

Core Size - 16-Bit

Speed - 40 MIPS

Program Memory Size - 32KB

RAM Size - 4KB

Voltage Supply - 3V to 3.6V

Operating Temperature - -40°C to 85°C

Quality and Safety Features

Brown-out Detect/Reset

Power-on Reset (POR)

Watchdog Timer (WDT)

Extended temperature range operation

Compatibility

Compatible with I2C, IrDA, LINbus, SPI, UART/USART protocols

Surface Mount 28-SOIC packaging for easy PCB design

Application Areas

Automotive control systems

Industrial automation

Communication systems

Robotics and embedded control

Product Lifecycle

Status: Active

Not nearing discontinuation

Options for upgrades and replacements available

Reasons to Choose This Product

Robust Digital Signal Processing capabilities for advanced applications

High-speed processing for real-time performance

Great variety in on-chip peripherals to reduce external component count

Low power usage to enhance product battery life and efficiency

Sturdy and reliable operation across a wide temperature range

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology DSPIC33FJ32GP302-I/SO

Product Attribute
Part Number	DSPIC33FJ32GP302-I/SO	DSPIC33FJ32GP204-I/PT	DSPIC33FJ32GP302T-I/MM	DSPIC33FJ32GP202-I/SP
Manufacturer	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology
Core Size	16-Bit	16-Bit	16-Bit	16-Bit
Oscillator Type	Internal	Internal	Internal	Internal
Series	dsPIC™ 33F	dsPIC™ 33F	dsPIC™ 33F	dsPIC™ 33F
Program Memory Size	32KB (32K x 8)	32KB (32K x 8)	32KB (32K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH	FLASH	FLASH
Package	Tube	Tray	Tape & Reel (TR)	Tube
Data Converters	A/D 10x10b/12b	A/D 13x10b/12b	A/D 10x10b/12b	A/D 10x10b/12b
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Through Hole
Core Processor	dsPIC	dsPIC	dsPIC	dsPIC
Peripherals	Brown-out Detect/Reset, DCI, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DCI, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DCI, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DCI, DMA, I²S, POR, PWM, WDT
Base Product Number	DSPIC33FJ32GP302	DSPIC33FJ32GP204	DSPIC33FJ32GP302	DSPIC33FJ32GP202
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
RAM Size	4K x 8	2K x 8	4K x 8	2K x 8
Supplier Device Package	28-SOIC	44-TQFP (10x10)	28-QFN-S (6x6)	28-SPDIP
Number of I/O	21	35	21	21
Package / Case	28-SOIC (0.295", 7.50mm Width)	44-TQFP	28-VQFN Exposed Pad	28-DIP (0.300", 7.62mm)
Speed	40 MIPs	40 MIPs	40 MIPs	40 MIPs
Connectivity	I²C, IrDA, LINbus, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART
EEPROM Size	-	-	-	-
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V	3V ~ 3.6V	3V ~ 3.6V

DSPIC33FJ32GP302-I/SO Datasheet PDF

Download DSPIC33FJ32GP302-I/SO pdf datasheets and Microchip Technology documentation for DSPIC33FJ32GP302-I/SO - Microchip Technology.

Datasheets: 16-bit Embedded Control Solutions.pdf DSPIC33FJzzzGPx02/x04 Datasheet.pdf
PCN Packaging: Label and Packing Changes 23/Sep/2015.pdf Packing Changes 10/Oct/2016.pdf
HTML Datasheet: 16-bit Embedded Control Solutions.pdf
PCN Assembly/Origin: SOIC-28L Palladium Coated Copper 29/Aug/2013.pdf
PCN Design/Specification: Multiple Devices 21/May/2013.pdf Multiple Devices Errata Revision 06/Aug/2013.pdf

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America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

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