Manufacturer Part Number
DSPIC33FJ16GS502T-I/MM
Manufacturer
Microchip Technology
Introduction
The DSPIC33FJ16GS502T-I/MM is a high-performance, 16-bit digital signal controller part of the dsPIC™ 33F series, designed for advanced embedded control applications.
Product Features and Performance
Core Processor: dsPIC
Core Size: 16-Bit
Speed: 40 MIPS
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Power-on Reset (POR), Pulse Width Modulation (PWM), Watchdog Timer (WDT)
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
RAM Size: 2K x 8
Data Converters: 16x10-bit A/D, 4x10-bit D/A
Oscillator Type: Internal
Product Advantages
This DSP controller combines high-performance processing with advanced peripheral integration and flexibility making it ideal for demanding control applications.
Key Technical Parameters
Number of I/O: 21
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Quality and Safety Features
Includes features such as Brown-out Detect/Reset and a Watchdog Timer for improved system reliability and safety.
Compatibility
Mounting Type: Surface Mount
Supplier Device Package: 28-QFN-S (6x6)
Package / Case: 28-VQFN Exposed Pad
Application Areas
Suitable for use in advanced embedded control applications including automotive, industrial, and consumer electronics where efficient, reliable operation in harsh environments is critical.
Product Lifecycle
The DSPIC33FJ16GS502T-I/MM is currently active and available with no notification of discontinuation. Potential upgrades or replacements can be sourced within the Microchip dsPIC™ or PIC series.
Several Key Reasons to Choose This Product
High-speed 16-bit DSP performance at 40 MIPS for efficient computation.
Comprehensive connectivity options including I2C, SPI, and UART for versatile interfacing.
Integrated advanced peripherals such as PWM and analog-to-digital converters facilitate multifunctional applications.
Reinforced with safety features such as Brown-out Reset to ensure reliable operation in diverse conditions.
Optimal package design for robust, yet flexible PCB design integration.