Manufacturer Part Number
DSPIC33EP256MC206T-I/PT
Manufacturer
Microchip Technology
Introduction
The DSPIC33EP256MC206T-I/PT is a high-performance, 16-Bit digital signal controller packed in a 64-TQFP package, designed for advanced motor control, automotive, and industrial applications.
Product Features and Performance
Core Processor: dsPIC
Core Size: 16-Bit
Speed: 70 MIPs
Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Program Memory Size: 256KB (85.5K x 24)
Program Memory Type: FLASH
RAM Size: 16K x 16
Data Converters: A/D 16x10b/12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Product Advantages
Optimized for real-time control applications
High-speed digital signal processing capabilities
Comprehensive set of peripherals enhancing system robustness
Large program memory allows handling complex algorithms and tasks
Key Technical Parameters
Number of I/O: 53
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Mounting Type: Surface Mount
Supplier Device Package: 64-TQFP (10x10)
Package / Case: 64-TQFP
Quality and Safety Features
Features brown-out detect/reset and power-on reset for reliable operations
Watchdog timer (WDT) for system recovery and fault management
Compatibility
Suitable for surface mount technology utilizing 64-TQFP package
Application Areas
Advanced motor control systems
Automotive applications
Industrial automation and process control
Consumer electronics
Product Lifecycle
Status: Active
The product is currently active with ongoing manufacturer support and no indications of nearing discontinuation.
Several Key Reasons to Choose This Product
Robust connectivity options supporting a variety of communications protocols
High-speed operation at 70 MIPS ideal for time-critical tasks
Extensive data conversion capabilities facilitating precise sensory and control operations
Tailored for rugged industrial environments with a wide operating temperature range
Comprehensive set of integrated features aiding in system reliability and reduction of external components needs