Manufacturer Part Number
DSPIC33EP256GP502-I/SO
Manufacturer
microchip-technology
Introduction
The DSPIC33EP256GP502-I/SO is a high-performance, 16-Bit digital signal controller designed for advanced embedded control applications. It is part of Microchip Technology's dsPIC™ 33EP Series.
Product Features and Performance
16-Bit dsPIC core with 70 MIPS speed
Integrated with CANbus, I2C, IrDA, LINbus, SPI, UART/USART for connectivity
Equipped with Brown-out Detect/Reset, DMA, POR, PWM, WDT peripherals
Offers 21 I/O pins
Provides 256KB of FLASH program memory
Features 16K x 16 RAM size
Supports voltage supply from 3V to 3.6V
Contains A/D converters (6x10b/12b)
Incorporates an internal oscillator
Product Advantages
High-speed performance suitable for demanding applications
Extensive connectivity options enabling versatile use in embedded systems
Enhanced peripheral set facilitating complex functions and tasks
Large program memory and RAM to accommodate sophisticated programs and data
Low-power operation through efficient voltage use
Key Technical Parameters
Core Processor: dsPIC
Core Size: 16-Bit
Speed: 70 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 16K x 16
Voltage Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Quality and Safety Features
Brown-out Detect/Reset and Watchdog Timer (WDT) for reliable operation
Operation within industrial temperature ranges ensures robust performance in harsh conditions
Compatibility
Surface Mount, 28-SOIC (0.295", 7.50mm Width) package for compatibility with standard PCBs
Application Areas
Industrial Control Systems
Automotive electronics
Robotics and automation
Communications systems
Product Lifecycle
Status: Active
The product is currently active with no indication of nearing discontinuation, ensuring long-term availability and support.
Several Key Reasons to Choose This Product
High-speed processing capability enhances system performance.
Comprehensive connectivity options enable use in a wide range of applications.
Large memory allocations support complex applications and software stacks.
Designed for low-power consumption, suitable for energy-sensitive projects.
Robust design for reliability in extended temperature ranges and challenging environments.