ATXMEGA256A3U-MH - Microchip Technology

Manufacturer Part Number

ATXMEGA256A3U-MH

Manufacturer

Microchip Technology

Introduction

AVR XMEGA A3U series 8/16-bit high-performance microcontroller

Product Features and Performance

32MHz maximum operating speed

I2C, IrDA, SPI, UART/USART, and USB connectivity options

Advanced peripherals including DMA, PWM, WDT, and BOD

50 general purpose I/O lines

256KB FLASH memory

4KB EEPROM storage

16KB internal RAM

Internal oscillator

12-bit analog-to-digital converter with 16 channels

2x12-bit digital-to-analog converters

Product Advantages

Low power consumption with a wide 1.6V to 3.6V supply range

High integration level suitable for complex applications

Robust interface options for enhanced communication capabilities

Comprehensive set of peripherals simplifying system design

Key Technical Parameters

Core Processor: AVR

Core Size: 8/16-Bit

Speed: 32MHz

Program Memory Size: 256KB (128K x 16)

EEPROM Size: 4K x 8

RAM Size: 16K x 8

Voltage - Supply (Vcc/Vdd): 1.6V ~ 3.6V

Data Converters: A/D 16x12b, D/A 2x12b

Operating Temperature: -40°C ~ 85°C (TA)

Mounting Type: Surface Mount

Package / Case: 64-VFQFN Exposed Pad

Quality and Safety Features

Brown-out Detect/Reset to prevent improper device operation

Watchdog Timer (WDT) to ensure system recovery from software errors

Power-on Reset (POR) for reliable operation during power fluctuations

Compatibility

USB 2.0 full-speed and low-speed device compatible

Supports SPI and I2C protocols for peripheral communications

Compatible with UART/USART connectivity for serial communication

IrDA interface for infrared data transmission

Application Areas

Industrial Control Systems

Consumer Electronics

Automotive

Medical Devices

Internet of Things (IoT)

Product Lifecycle

Active status with ongoing manufacturer support

Not nearing discontinuation; potential for future upgrades

Several Key Reasons to Choose This Product

Versatile and fast core processor enhances processing capability

Extensive memory capacity well-suited for complex applications

Multiple power-saving modes for energy-efficient design

Comprehensive connectivity options for various communication needs

Tight integration of peripherals reduces additional component requirements

Robust operating temperature range suitable for harsh environments

Surface mount package aligns with modern PCB assembly processes

Proven manufacturer with support and resources available