Manufacturer Part Number
A3PE1500-1FGG676I
Manufacturer
Microchip Technology
Introduction
The A3PE1500-1FGG676I is a part of Microchip Technology's ProASIC3E series of embedded FPGAs, designed for a wide range of electronic applications that require programmable logic solutions.
Product Features and Performance
High-density FPGA with 1,500,000 system gates
276,480 total RAM bits for flexible data storage
444 I/O pins for extensive connectivity options
Support for 1.425V to 1.575V supply voltage for low power consumption
Surface Mount 676-BGA package for compact PCB design
Operational temperature range from -40°C to 100°C, suitable for harsh environments
ProASIC3E series known for high performance and reliability
Product Advantages
Customizable logic allows for tailored functionality to specific needs
Low power operation helps minimize energy consumption
Ample I/Os and memory provide versatility in complex designs
Robust temperature range ensures functionality in extreme conditions
ProASIC3E series offers a well-established platform with a history of success
Key Technical Parameters
5 million gates
444 I/O pins
276,480 RAM bits
Voltage supply range between 1.425V and 1.575V
Operating temperature from -40°C to 100°C
676-BGA package form factor
Quality and Safety Features
Complies with industry-standard quality and safety regulations
BGA package ensures a reliable solder joint for surface mounting
Extended operating temperature range for high reliability in variable climates
Compatibility
Compatible with standard PCB Surface Mount processes
Interoperable with various digital and analog components due to flexible I/O voltage support
Application Areas
Telecommunications
Industrial automation and control systems
Automotive electronics
Consumer electronics
Medical devices
Aerospace and defense systems
Product Lifecycle
Status: Active
Not currently nearing discontinuation, ensuring supply availability
Potential future replacements or upgrades might become available as technology advances
Several Key Reasons to Choose This Product
High gate density for complex logic designs
Ample RAM and I/O flexibility cater to demanding applications
Low power consumption conducive for energy-efficient designs
Proven track record of ProASIC3E series in diverse applications
Support from Microchip Technology for development and deployment
Wide operating temperature range makes it viable for extreme conditions
Long product lifecycle assures long-term availability and support
Consistent quality from a reputable semiconductor manufacturer