Manufacturer Part Number
MPC855TZQ50D4
Manufacturer
NXP Semiconductors
Introduction
The MPC855TZQ50D4 is part of the NXP Semiconductors MPC8xx series of embedded microprocessors.
Product Features and Performance
1 Core, 32-Bit architecture
Speed of 50MHz
Integrated Communications Processor Module (CPM)
Support for DRAM controllers
Lacks Graphics Acceleration
Dual Ethernet support with speeds of 10Mbps and 10/100Mbps
Operates at an I/O voltage of 3.3V
Surface Mount, 357-BBGA package
Product Advantages
Advanced integration for communications applications
Low power consumption at 3.3V I/O voltage
Support for multiple interfaces enhances versatility
Key Technical Parameters
Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Ethernet: 10Mbps and 10/100Mbps
Voltage - I/O: 3.3V
Operating Temperature Range: 0°C ~ 95°C
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Quality and Safety Features
Robust operating temperature range up to 95°C
Compatibility
Compatible with various communication interfaces including HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Application Areas
Embedded systems for networking and communications
Product Lifecycle
Obsolete product status
Alternatives or upgrades may be available for new designs
Several Key Reasons to Choose This Product
Proven processor architecture (MPC8xx) suitable for embedded applications
Comprehensive communication interface support enables diverse application uses
Surface mount technology for reliable and streamlined PCB integration
Extended operational temperature range suitable for challenging environments
The legacy product may have an established reliability record in existing designs