XIO2000AZZZ - Texas Instruments

Manufacturer Part Number

XIO2000AZZZ

Manufacturer

Texas Instruments

Introduction

The XIO2000AZZZ is a dedicated interface chip designed by Texas Instruments for translating PCI Express to PCI.

Product Features and Performance

Dedicated interface for PCI Express to PCI translation.

Supports dual voltage supply for flexible power management.

Provided in a 201-LFBGA package for robust physical integration.

Surface Mount technology for efficient assembly.

Utilizes the efficient BGA MICROSTAR package.

Product Advantages

Enables seamless translation between PCI Express and PCI interfaces.

Dual voltage support enhances compatibility with various power systems.

Compact BGA package allows for reduced space usage on PCBs.

Surface Mount technology simplifies the manufacturing process.

Key Technical Parameters

Interface: PCI

Voltage Supply: 1.35V ~ 1.65V, 3V ~ 3.6V

Package / Case: 201-LFBGA

Supplier Device Package: 201-BGA MICROSTAR (15x15)

Quality and Safety Features

Manufactured by Texas Instruments, ensuring high reliability and performance.

Robust LFBGA package provides enhanced durability and protection for the chip.

Compatibility

Specifically designed for devices requiring PCI Express to PCI translation.

Compatible with dual voltage power supplies.

Application Areas

Suitable for upgrading or interfacing legacy PCI systems with new PCI Express technology.

Product Lifecycle

Currently marked as Obsolete.

Users should seek replacements or consider upgrading as production may not continue.

Availability of replacements or upgrades needs to be checked with Texas Instruments or authorized distributors.

Several Key Reasons to Choose This Product

Ideal for integration and upgrade of systems needing PCI to PCI Express translation.

Reliable performance, backed by Texas Instruments’ reputation and expertise.

Dual voltage support provides flexibility in connected devices.

Surface mount technology eases the assembly process on PCBs.

Compact package design facilitates a reduced footprint on system boards.