Manufacturer Part Number
UCC27516DRSR
Manufacturer
Texas Instruments
Introduction
The UCC27516DRSR is a single-channel, low-side gate driver designed for power management applications, specifically targeting IGBT and N-Channel MOSFET driving.
Product Features and Performance
Single low-side driver configuration
Supports IGBT and N-Channel MOSFET gates
Supply Voltage range from 4.5V to 18V
Output current capacity of 4A source and sink
Fast switching with rise and fall times of 8ns and 7ns respectively
Dual input logic interface (inverting and non-inverting)
Logic thresholds set at 1V (VIL) and 2.4V (VIH)
Operational in high temperature environments (up to 140°C)
Small surface mount package (6-WDFN exposed pad)
Product Advantages
Efficiency through fast switching speeds minimizing energy losses
Flexibility with dual input type compatibility
Robust thermal performance suitable for harsh environments
Compact design facilitates integration into tight PCB layouts
Key Technical Parameters
Number of Drivers: 1
Voltage – Supply: 4.5V ~ 18V
Current Peak Output: 4A source, 4A sink
Logic Voltage VIL, VIH: 1V, 2.4V
Rise / Fall Time: 8ns / 7ns
Operating Temperature: -40°C ~ 140°C
Quality and Safety Features
Enhanced thermal management through the exposed pad package
Stable operation under a wide range of supply voltages and temperatures
Compatibility
Compatible with both IGBT and N-Channel MOSFET devices
Flexible logic interface working with various control signal voltages
Application Areas
Power management systems
Motor control circuits
Renewable energy inverters
High efficiency DC/DC converters
Product Lifecycle
Currently active product
No reported discontinuation, with ongoing support and availability
Several Key Reasons to Choose This Product
High current drive capability ensures robust gate driving
Suitable for a broad range of supply voltages enhancing adaptability across multiple applications
Ultra-fast switching times improve overall efficiency of power systems
Dual input logic offers versatile control schemes
Reliable performance in a compact and thermally enhanced package ideal for space-constrained applications