Manufacturer Part Number
UCC27425P
Manufacturer
Texas Instruments
Introduction
The UCC27425P is a robust and efficient low-side MOSFET driver designed for high-speed applications in power management systems.
Product Features and Performance
Independent dual-channel configuration
Compatible with both N-Channel and P-Channel MOSFETs
Capable of supplying peak output current of 4A from each driver
Rapid transition times with rise time typically 20ns and fall time typically 15ns
Operates across a wide supply voltage range from 4V to 15V
Product Advantages
High-current drive strength enhances switching performance
Flexible input logic levels allow for easy integration
Provides design versatility due to its ability to drive a wide range of MOSFETs
Extended operating temperature range ensures reliability in various environments
Key Technical Parameters
Drive Configuration: Low-Side
Channel Type: Independent
Number of Drivers: 2
Gate Type Compatibility: N-Channel, P-Channel MOSFET
Input Logic Voltage (VIL, VIH): 1V, 2V
Supply Voltage Range: 4V ~ 15V
Output Current (Source, Sink): 4A, 4A
Rise Time (Typical): 20ns
Fall Time (Typical): 15ns
Mounting Type: Through Hole
Quality and Safety Features
Robust operating temperature range from -40°C to 125°C ensures stability in demanding conditions
Compatibility
Compatible with a variety of N-Channel and P-Channel MOSFETs for versatile applications
Logic compatible with typical signal level requirements
Through-hole 8-PDIP package compatible with standard PCB designs
Application Areas
Motor Control Systems
Power Converters
Power Supply Units
DC to DC Converters
Switch Mode Power Supplies (SMPS)
Product Lifecycle
Product Status: Last Time Buy
Indicates end-of-life cycle with a need to consider replacements or upgrades
Several Key Reasons to Choose This Product
High reliability with extended operational temperature range
Versatile power driver for both N-Channel and P-Channel MOSFETs
Texas Instruments' track record of producing robust power management devices
Highly efficient switching capabilities reducing power dissipation
Simplified design integration due to through-hole package compatibility
Immediate availability for designs requiring quick turnaround before product discontinuation