UC2855BN - Texas Instruments

Manufacturer Part Number

UC2855BN

Manufacturer

Texas Instruments

Introduction

The UC2855BN is an integrated circuit for power management specializing in Power Factor Correction (PFC) applications.

Product Features and Performance

Average Current Mode for PFC

High Switching Frequency of 500kHz

Low Startup Current of 150 µA

Supply Voltage Range from 10.5V to 20V

Operational Temperature from -40°C to 85°C

Through Hole Mounting Type for easy installation

Suited for high-density power applications

Product Advantages

Improves energy efficiency by correcting power factor

Enables smaller, lighter power supply designs

Reduces overall system costs due to high integration

Key Technical Parameters

Frequency - Switching: 500kHz

Current - Startup: 150 µA

Voltage - Supply: 10.5V to 20V

Operating Temperature: -40°C to 85°C

Mounting Type: Through Hole

Package / Case: 20-DIP

Supplier Device Package: 20-PDIP

Quality and Safety Features

Conforms to international quality and safety standards for Power Management ICs

Built-in protection features for enhanced reliability

Compatibility

Designed for use in power conversion and management applications

Compatible with a variety of microcontrollers and digital systems

Application Areas

Switched-mode power supplies

AC-DC power converters

Power supplies for personal computers

Industrial power systems

Product Lifecycle

Last Time Buy status indicating the product is nearing end-of-life

Replacements or upgrade options are available and should be considered

Several Key Reasons to Choose This Product

Highly efficient power factor correction

Capable of achieving low total harmonic distortion

Robust thermal performance for reliability in a range of conditions

Texas Instruments' reputation for quality and support

Offers potential size and cost reductions for power supply designs

Available in industry-standard DIP package for ease of replacement and design compatibility

High switching frequency accommodates compact magnetics, reducing overall design footprint