Manufacturer Part Number
TXS0206YFPR
Manufacturer
Texas Instruments
Introduction
The TXS0206YFPR is a voltage level translator designed for bidirectional voltage translation between two different power domains.
Product Features and Performance
Bidirectional voltage translation
Designed for multi-voltage system interfacing
4 channels supporting simultaneous bidirectional communication
Open drain output type for flexible design
High-speed data rate support up to 60Mbps
Integrated SIM card interface functionality
Low supply voltage operation from 1.1V to 3.6V for both VCCA and VCCB
Compatible with push-pull or open-drain drive
Low power consumption supporting battery-powered applications
Product Advantages
Supports a wide range of applications with versatile bidirectional translation
Optimal for high-speed interfacing needs with up to 60Mbps data rate
Integrated features for direct SIM card communication, avoiding need for external components
Space-saving design with a 20-XFBGA, DSBGA package
Surface mount package for ease of PCB design and assembly
Key Technical Parameters
Number of Circuits: 1
Channels per Circuit: 4
Voltage VCCA: 1.1 V ~ 3.6 V
Voltage VCCB: 1.1 V ~ 3.6 V
Open Drain Output Type
Temperature operating range from -40°C ~ 85°C
Data rate capability up to 60Mbps
Quality and Safety Features
Built-in ESD protection for increased reliability
Compliant with industry-standard regulations and Texas Instruments' quality standards
Compatibility
Supports a wide range of input and output logic levels for extensive compatibility
Suitable for use in multi-voltage digital systems
Application Areas
Mobile and portable devices
Signal level translation in multi-voltage environments
Interface bridging for different domain voltages in embedded systems
SIM card interfaces in communication devices
Product Lifecycle
Active product indicated as currently in production
Not specified as nearing discontinuation
Longevity support can be expected with replacement or upgrades usually available
Several Key Reasons to Choose This Product
Provides essential interconnect between systems operating at different logic levels
Minimizes inter-system communication issues with high-speed data transfer capabilities
Simplifies design complexity with features catered toward mobile and SIM interfaces
Enhances product durability and longevity with Texas Instruments’ proven manufacturing standards
Flexible power domain compatibility, reducing the need for additional level shifting components