TS5A23166YZPR - Texas Instruments

Manufacturer Part Number

TS5A23166YZPR

Manufacturer

Texas Instruments

Introduction

The TS5A23166YZPR is an analog switch designed for interfacing in signal routing applications.

Product Features and Performance

Dual-single-pole single-throw (SPST) configuration.

Ultra-low on-state resistance of 900mOhm.

High channel-to-channel matching of 40mOhm.

Rapid switching time of 7.5ns on and 11ns off.

Broad -3db bandwidth of 150MHz.

Low charge injection of 6pC.

Channel Capacitance maintains 19pF for CS(off) and 18pF for CD(off).

Maximum leakage current of 20nA.

Exceptional crosstalk performance of -85dB at 1MHz.

Product Advantages

Minimized signal distortion due to low on-state resistance.

Suitable for precision applications with consistent channel-to-channel performance.

Quick response time suitable for high-frequency applications.

Designed for low noise and minimal signal interference.

Key Technical Parameters

On-State Resistance: 900mOhm Max

Voltage-Supply (Single): 1.65V~5.5V

Crosstalk: -85dB @ 1MHz

Switch Time (Ton, Toff): 7.5ns, 11ns

Operating Temperature: -40°C ~ 85°C

Quality and Safety Features

Rigorous channel-to-channel matching for reliable operation.

Built-in protection against excessive leakage and charge injection.

Compatibility

Designed to be interfaced with a variety of control signal levels (1.65V to 5.5V).

Application Areas

Suitable for multiplexing and demultiplexing applications.

Useful for signal gating in communication devices, data processing equipment, and portable devices.

Product Lifecycle

Currently marked as active with continuous support and supply.

No imminent plans for discontinuation, with ongoing production and availability.

Several Key Reasons to Choose This Product

Consistently low on-state resistance ensures minimal signal loss.

High-speed switching capabilities ideal for quick switching needs.

Extremely low crosstalk enhances signal integrity in multi-channel applications.

Wide operating temperature range caters to various environmental conditions.

Robust packaging suitable for compact and high-density mounting requirements.