Manufacturer Part Number
TMDS171RGZR
Manufacturer
Texas Instruments
Introduction
The TMDS171RGZR is an active interface specialized integrated circuit designed for signal retiming applications.
Product Features and Performance
Integrated retimer for high-speed signal conditioning
Enhanced signal integrity for extended PCB trace lengths
Low power consumption optimized for energy efficiency
Programmable via I2C interface for flexible configuration
Supports TMDS signaling for robust data transmission
Product Advantages
Improves signal quality for reliable data transfer
Extends the operational range of high-speed interfaces
Simplifies PCB layout with reduced need for additional components
Enables advanced features through programmable settings
Key Technical Parameters
Interface Specialized: Retimer
Voltage Supply: 3.135V to 3.465V
I2C interface compatibility for device configuration
Suited for 48-VFQFN Exposed Pad package implementation
Surface Mount mounting type for ease of assembly on PCBs
Quality and Safety Features
Complies with industry-standard quality and safety regulations
Manufactured by Texas Instruments, known for reliable and robust components
Compatibility
Compatible with devices requiring TMDS-based signal retiming
Interface with I2C allows for programmable settings and adaptability across various systems
Application Areas
High-definition multimedia interfaces (HDMI)
Digital Visual Interface (DVI) links
Other applications requiring clean and stable high-speed signal transmission
Product Lifecycle
Product status: Active
Consistently supported with ongoing production and no near-term discontinuation
Availability of replacements or upgrades as technology progresses
Several Key Reasons to Choose This Product
Texas Instruments' reputation for high-quality and cutting-edge technology
Reduces design complexity and improves end-product performance
Provides a solution for extending signal reach without degradation
Tightly controlled supply voltage range tailored for modern electronics
Surface mount design aligns with industry-standard assembly processes
Futuristic approach with potential for firmware updates via I2C interface