Manufacturer Part Number
TLV320AIC3100IRHBT
Manufacturer
Texas Instruments
Introduction
The TLV320AIC3100 is an integrated audio codec with a variety of features designed for portable applications.
Product Features and Performance
Audio codec with integrated signal processing
Two ADCs and two DACs with high-resolution 32-bit processing
Supports I2C data interface for easy communication
Sigma Delta modulation used for superior audio conversion
Surface Mount, 32-VFQFN Exposed Pad packaging for dense PCB layouts
Product Advantages
Provides high Signal-to-Noise Ratio (SNR) of 91dB for ADCs and 95dB for DACs, ensuring clear audio capture and playback
Operates on low supply voltage, making it suitable for battery-powered devices
Operational in a wide temperature range from -40°C to 85°C, suitable for harsh environments
Key Technical Parameters
32-bit resolution for enhanced audio clarity
Two ADCs and two DACs for simultaneous audio input and output processing
Operates on analog power supply of 2.7V to 3.6V and digital power supply of 1.65V to 1.95V
Quality and Safety Features
Built to operate reliably in extended temperature ranges
Manufactured by Texas Instruments, a leader in semiconductor reliability
Compatibility
Compatible with a broad range of microcontrollers and processors via I2C interface
Can be integrated into various audio systems due to flexible voltage requirements
Application Areas
Portable audio devices
Smartphones and voice-activated devices
Audio peripherals and sound processing equipment
Product Lifecycle
Currently active and not nearing discontinuation
Texas Instruments provides support and potential future upgrades
Several Key Reasons to Choose This Product
High-resolution audio processing capabilities ensure superior sound quality
Designed for low-power applications, extending battery life in portable devices
Robust functionality supports a wide range of audio formats and interfaces
Backed by Texas Instruments' reputation for quality and support
Suitable for demanding applications with a wide operating temperature range
Adaptable to compact PCB layouts with small form factor packaging
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