Manufacturer Part Number
TLV2774IDR
Manufacturer
Texas Instruments
Introduction
The TLV2774IDR is a quad channel, rail-to-rail input and output operational amplifier (op-amp) from Texas Instruments.
Product Features and Performance
Quad CMOS op-amp with rail-to-rail input and output
Wide supply voltage range of 2.5V to 5.5V
Low supply current of 1mA per channel
High gain bandwidth of 5.1MHz
Fast slew rate of 10.5V/μs
Very low input offset voltage of 700μV
Ultra-low input bias current of 2pA
Wide operating temperature range of -40°C to 125°C
Product Advantages
Excellent performance in a small footprint
Suitable for a wide range of low-power, high-precision analog applications
Robust design with protection against latch-up
Key Technical Parameters
Manufacturer Part Number: TLV2774IDR
Number of Circuits: 4
Gain Bandwidth Product: 5.1MHz
Voltage Supply Span (Min/Max): 2.5V to 5.5V
Current Supply: 1mA per channel
Slew Rate: 10.5V/μs
Voltage Input Offset: 700μV
Amplifier Type: CMOS
Current Output / Channel: 50mA
Current Input Bias: 2pA
Quality and Safety Features
RoHS3 compliant
14-SOIC package for surface mount assembly
Compatibility
The TLV2774IDR is compatible with a wide range of analog and mixed-signal circuits, making it suitable for use in various applications.
Application Areas
Instrumentation and measurement equipment
Industrial control systems
Medical devices
Portable electronics
Sensor signal conditioning
Product Lifecycle
The TLV2774IDR is an active product from Texas Instruments, and there are no immediate plans for discontinuation. Replacements and upgrades may be available in the future as technology evolves.
Key Reasons to Choose This Product
Excellent performance in a small, space-saving package
Wide supply voltage range and low power consumption, making it suitable for battery-powered and portable applications
Robust design with protection against latch-up, ensuring reliable operation
Versatile compatibility with a wide range of analog and mixed-signal circuits
Availability of multiple channels in a single package, reducing board space and component count