TLV172IDCKR - Texas Instruments

Manufacturer Part Number

TLV172IDCKR

Manufacturer

Texas Instruments

Introduction

The TLV172IDCKR is a general-purpose operational amplifier (op-amp) with a rail-to-rail output. It is designed for use in a variety of instrumentation and measurement applications.

Product Features and Performance

Operates on a wide supply voltage range of 4.5V to 36V

Consumes low supply current of 1.6mA

Offers a high gain bandwidth of 10MHz

Provides a slew rate of 10V/μs

Features low input offset voltage of 500μV

Exhibits low input bias current of 10pA

Delivers an output current of up to 75mA per channel

Product Advantages

Wide supply voltage range for versatile applications

Low power consumption for energy-efficient designs

High gain bandwidth for high-speed signal processing

Precise and stable operation with low input offset and bias current

High output drive capability for driving various loads

Key Technical Parameters

Supply Voltage: 4.5V to 36V

Supply Current: 1.6mA

Gain Bandwidth Product: 10MHz

Slew Rate: 10V/μs

Input Offset Voltage: 500μV

Input Bias Current: 10pA

Output Current: 75mA per channel

Quality and Safety Features

RoHS3 compliant for environmental compliance

Packaged in a compact SC-70-5 surface-mount package

Compatibility

Suitable for a wide range of instrumentation and measurement applications

Application Areas

Instrumentation and measurement equipment

Industrial control systems

Medical devices

Electronic test and measurement instruments

General-purpose amplifier circuits

Product Lifecycle

The TLV172IDCKR is an active and available product from Texas Instruments.

Several Key Reasons to Choose This Product

Wide supply voltage range for versatile applications

Low power consumption for energy-efficient designs

High gain bandwidth for high-speed signal processing

Precise and stable operation with low input offset and bias current

High output drive capability for driving various loads

RoHS3 compliance for environmental responsibility

Compact surface-mount packaging for space-constrained designs