Manufacturer Part Number
TLK1501IRCPR
Manufacturer
Texas Instruments
Introduction
High-speed 1.5Gbps serializer/deserializer (SerDes) for high-performance data transfer applications.
Product Features and Performance
High data rate of 1.5Gbps
Supports 16-bit LV TTL input/output interfaces
Converts parallel data to serial data and vice versa
Low Voltage Differential Signaling for input and Complementary Metal-Oxide Semiconductor for output
Provides flexibility with 16 inputs and 1 output or 1 input and 16 outputs
Supports a wide voltage supply range from 2.3V to 2.7V
Operable across industrial temperature ranges from -40°C to 85°C
Designed for surface mount technology
Housed in a 64-pin PowerVFQFP package
Product Advantages
High-speed bridge between card and back-plane or optical fiber
Robust signal integrity through LVDS
Enhanced system reliability with support for hot-plugging
Low power consumption for energy-efficient operation
Key Technical Parameters
Data Rate: 1.5Gbps
Input Type: LVTTL
Output Type: CML
Number of Inputs: 16/1
Number of Outputs: 1/16
Voltage Supply: 2.3V ~ 2.7V
Operating Temperature: -40°C ~ 85°C
Quality and Safety Features
Built to Texas Instruments' stringent quality standards
Provides reliable high-speed data communication
Optimal thermal performance with a specified operating temperature range
Compatibility
Compatible with a variety of LV TTL and CML-related interfaces
Easily interfaced with a broad range of microprocessors and FPGAs
Application Areas
Telecommunications
Data communications
High-speed data acquisition systems
Network equipment and switches
Professional video and imaging equipment
Product Lifecycle
Active product status
Not nearing discontinuation
Continual support and availability of replacements or upgrades
Several Key Reasons to Choose This Product
High-speed performance enables advanced system capabilities
Texas Instruments' reputation for reliability and quality
Versatile use in a wide range of application areas
Active product provided with long-term support
Compact and power-efficient design suitable for surface mounting and high-density applications
Broad compatibility enhances system integration options