TLE2425CD - Texas Instruments

Manufacturer Part Number

TLE2425CD

Manufacturer

Texas Instruments

Introduction

The TLE2425CD is a precision ground reference voltage source designed for power management applications, presented in a durable 8-SOIC packaging. This device serves as a virtual ground to create a biphasic supply from a single input voltage.

Product Features and Performance

Stable 2.5V output voltage

Supports up to 20 mA output current

Tolerance of ±0.8% providing precision output

Temperature coefficient of 20ppm/°C typical for temperature stability

Low noise output of 100µVrms from 10Hz to 10kHz

Wide input voltage range from 4V to 40V

Product Advantages

High precision voltage for critical applications

Significant temperature stability for consistent performance

Flexible input voltage catering to various power sources

Minimal noise interference in sensitive circuits

Key Technical Parameters

Voltage Output (Min/Fixed): 2.5V

Current Output: 20 mA

Tolerance: ±0.8%

Temperature Coefficient: 20ppm/°C Typical

Voltage Input: 4V ~ 40V

Operating Temperature: 0°C ~ 70°C (TA)

Quality and Safety Features

Reliable operation within specified temperature ranges

Built according to Texas Instruments' rigorous quality standards

Compatibility

Suited for surface mount technology (SMT) with its 8-SOIC packaging, making it compatible with a wide range of PCB designs.

Application Areas

Precision power supply systems

Sensor applications

Analog-to-Digital Convertor (ADC) power supplies

Biphasic circuit supplies

Product Lifecycle

The TLE2425CD is in a "Last Time Buy" status, indicating it is nearing discontinuation. Users should explore replacements or consult Texas Instruments for upgrades.

Several Key Reasons to Choose This Product

High precision output voltage increases the reliability of power-sensitive components.

Capable of operating across a wide range of input voltages, enhancing flexibility in design.

Low noise feature is ideal for applications requiring minimal interference.

The product’s lifespan signifies the need for planning towards future replacements or next-generation products.

Surface-mount packaging aligns with modern PCB assembly techniques for efficient manufacturing.