TL331BIDBVR - Texas Instruments

Manufacturer Part Number

TL331BIDBVR

Manufacturer

Texas Instruments

Introduction

The TL331BIDBVR is a high-performance single differential comparator.

Product Features and Performance

Single differential input

General purpose comparator

Open-collector and rail-to-rail output

Wide supply voltage range from 3V to 36V

Low input offset voltage

Ultra-low input bias current

High output current

Low quiescent current

Capable of operating over a wide temperature range

Product Advantages

Flexible power supply compatibility

Precision operation with low voltage offset

Suitable for battery-powered devices due to ultra-low input bias

Robust output for direct interface with other circuit elements

Energy-efficient for low-power applications

Key Technical Parameters

Supply Voltage Range: 3V ~ 36V

Input Offset Voltage (Max): 2.5mV @ 36V

Input Bias Current (Max): 0.025µA @ 5V

Output Current (Typ): 18mA @ 5V

Quiescent Current (Max): 430µA

Propagation Delay (Max): 1µs (Typ)

Operating Temperature Range: -40°C ~ 125°C

Quality and Safety Features

Built to industry standards for reliability and longevity

Tested for operation in extreme temperatures for high durability

Compatibility

Compatible with other standard logic and power systems due to open-collector and rail-to-rail output

Industry standard SOT-23-5 packaging for surface mount technology

Application Areas

Industrial automation

Electronics control systems

Power monitoring

Automotive systems

Battery-powered applications

Product Lifecycle

Currently listed as active

No indication of nearing discontinuation

Availability of replacements or upgrades not specified

Several Key Reasons to Choose This Product

Precision characteristic ensures accurate signal comparison

Wide supply range enhances utility in diverse power environments

Superior low power consumption fits energy-sensitive applications

High reliability supported by Texas Instruments' reputation

Suitable for commercial, automotive, and industrial applications given the extended temperature range

Streamlined integration due to convenient packaging and size for high-density board designs