SN74HCT573DW - Texas Instruments

Manufacturer Part Number

SN74HCT573DW

Manufacturer

Texas Instruments

Introduction

The SN74HCT573DW is a D-type transparent latch from Texas Instruments, suitable for holding data at their outputs based on the control provided by the latch-enable input.

Product Features and Performance

Logic Type: D-Type Transparent Latch

Circuit: 8:8, meaning there are 8 latches that each store 8 bits

Output Type: Tri-State, allowing the outputs to be in one of three states: high, low, or high impedance

Voltage Supply Range: 4.5V to 5.5V

Independent Circuits: 1

Propagation Delay Time: 25ns

Current Output High, Low: 6mA

Operating Temperature Range: -40°C to 85°C

Mounting Type: Surface Mount

Packaging in Tubes

Product Advantages

Tri-State output provides high flexibility for bus-oriented applications.

Wide operating temperature range ensures reliability under extreme conditions.

Key Technical Parameters

Voltage Supply: 4.5V ~ 5.5V

Propagation Delay Time: 25ns

Output Current: 6mA High, 6mA Low

Operating Temperature: -40°C ~ 85°C

Quality and Safety Features

Manufactured under rigorous standards for ensuring consistent performance and quality.

Compatibility

Compatible with a broad range of supply voltages and existing systems due to its 4.5V to 5.5V voltage range and standard SOIC package.

Application Areas

Ideal for buffer storage, control systems, and data management in various electronic applications such as computers, data processing, and telecommunications.

Product Lifecycle

Discontinued at Digi-Key, indicating the model might be nearing the end of its lifecycle.

Users should verify the availability of replacements or upgrades while considering future needs.

Several Key Reasons to Choose This Product

High data storage and retention capacity with 8-bit latches.

Flexible and robust output handling because of Tri-State outputs.

Versatile and reliable performance across a wide range of operating temperatures.

Suitable for complex electronic systems due to easy incorporation with existing technologies via its surface mount packaging.