SN74CB3T3257DGVR - Texas Instruments

Manufacturer Part Number

SN74CB3T3257DGVR

Manufacturer

Texas Instruments

Introduction

The SN74CB3T3257DGVR is a high-performance IC from Texas Instruments, designed for logic signal switching, multiplexing, and decoding in digital circuits.

Product Features and Performance

Efficient multiplexer/demultiplexer function with a 4 x 2:1 configuration.

Supports a single supply voltage for seamless integration into various circuit designs.

Optimized for low power consumption, enhancing battery life in portable applications.

Robust design ensuring reliable performance in a broad range of operational conditions.

Product Advantages

Enables flexible signal routing within digital circuits, increasing design versatility.

Low on-state resistance reduces power loss and improves signal integrity.

Compact 16-TFSOP packaging is ideal for space-constrained applications.

Ease of use with a simple control interface, facilitating rapid development and deployment.

Key Technical Parameters

Circuit configuration: 4 x 2:1

Independent Circuits: 1

Voltage Supply Source: Single Supply

Voltage Supply: 2.3V ~ 3.6V

Operating Temperature: -40°C ~ 85°C

Mounting Type: Surface Mount

Package/Case: 16-TFSOP (0.173", 4.40mm Width)

Quality and Safety Features

Manufactured to high quality standards, ensuring reliability and durability.

Designed for operational stability within specified temperature ranges.

Compatibility

Compatible with a wide range of digital signal processing and control applications.

Single supply voltage requirement simplifies integration with existing circuit designs.

Application Areas

Telecommunications

Computing devices

Consumer electronics

Industrial equipment

Automotive systems

Product Lifecycle

Currently active with no announced discontinuation date.

Support for upgrades and replacements is available.

Several Key Reasons to Choose This Product

High performance and reliability offered by Texas Instruments.

Enhanced design flexibility through efficient signal routing capabilities.

Low power consumption and heat generation improve system efficiency.

Compact and robust packaging suitable for a wide variety of applications.

Continuous product support and availability ensure long-term deployment security.