SN74AUP1G17DSFR - Texas Instruments

Manufacturer Part Number

SN74AUP1G17DSFR

Manufacturer

Texas Instruments

Introduction

Low-power single Schmitt-trigger buffer designed for 0.8V to 3.6V VCC operation

Product Features and Performance

Single non-inverting buffer

One element per chip

One bit width

Schmitt-trigger input for enhanced noise immunity

Push-pull output type

Capable of driving 4mA at both high and low outputs

Supports 0.8V to 3.6V supply voltage

Works within an operating temperature range of -40°C to 85°C

Surface-mount technology for board efficiency

6-pin XSON package for compact design

Product Advantages

High noise immunity due to Schmitt-trigger action

Ultra-low power consumption suitable for battery-powered applications

Wide range of operating voltages for flexible usage in various circuits

Small form factor for space-constrained designs

Robust performance in extended temperature environments

Key Technical Parameters

Supply Voltage (VCC): 0.8V to 3.6V

Output Current: 4mA High, 4mA Low

Operating Temperature Range: -40°C to 85°C

Mounting Type: Surface Mount

Package / Case: 6-XFDFN

Device Package: 6-SON (1x1)

Quality and Safety Features

Conformance to industry standards ensuring reliability

Manufactured by Texas Instruments, a leader in semiconductor solutions

Compatibility

Compatible with other logic families when within voltage range

Suitable for interfacing with microcontrollers and other digital systems

Application Areas

Consumer electronics

Industrial controls

Portable and battery-powered devices

Embedded systems

Data transmission

Product Lifecycle

Active product status

Not nearing discontinuation

Replacements or upgrades typically available from the same series

Several Key Reasons to Choose This Product

Ultra-low power consumption enhances battery life

Broad voltage range compatibility ensures versatility in different applications

Schmitt-trigger inputs provide higher noise immunity

Texas Instruments' reputable quality and performance reliability

Compact package design fits into tight PCB layouts

High performance at a wide operating temperature suitable for harsh environments