Manufacturer Part Number
SN74AHCT244QDWRQ1
Manufacturer
Texas Instruments
Introduction
The SN74AHCT244QDWRQ1 is a logic buffer device, part of the 74AHCT series, designed for automotive applications. It operates as a non-inverting buffer.
Product Features and Performance
Contains two elements with four bits per element
Non-inverting buffers enhance signal integrity for complex circuits
Outputs can enter a high-impedance state (3-State) to reduce power consumption
Supports 4.5V to 5.5V operating supply voltage for compatibility with standard logic levels
Tested for operation from -40°C to 125°C, assuring reliability under extreme conditions
Product Advantages
AEC-Q100 qualification signifies adherence to stringent automotive industry standards
The SN74AHCT244QDWRQ1 can drive lines with high levels of capacitance, providing robust signal integrity
Enhanced electrostatic discharge (ESD) protection ensures increased ruggedness
Low quiescent current improves energy efficiency
Key Technical Parameters
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 4
Current Output High, Low: 8mA
Voltage Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Quality and Safety Features
AEC-Q100 qualified
Operation validated across a wide temperature range for high reliability
Enhanced ESD protection
Compatibility
Compatible with 4.5V to 5.5V logic levels, allowing integration with a variety of circuits
Surface mount 20-SOIC package supports standard PCB assembly techniques
Application Areas
Automotive electronics
Signal buffering in digital communication systems
Logic level translation
High-speed data pathways
Product Lifecycle
Status: Active
Not currently nearing discontinuation with available upgrades and replacements for future integration
Several Key Reasons to Choose This Product
Automotive-grade reliability and robustness due to AEC-Q100 qualification
High thermal and electrical performance across a wide operating temperature range
Compatibility with standard logic levels ensures easy integration into existing designs
Low power dissipation and high drive capability optimize system performance
Surface mount packaging simplifies assembly on modern PCB layouts