SN74AC573DWR - Texas Instruments

Manufacturer Part Number

SN74AC573DWR

Manufacturer

Texas Instruments

Introduction

The SN74AC573DWR is a D-Type transparent latch from Texas Instruments' 74AC series, designed for high-speed, low-power memory storage.

Product Features and Performance

Logic Type: D-Type Transparent Latch

Circuit: 8-bit wide data storage

Output Type: Tri-State, allowing bidirectional data flow

Number of Independent Circuits: 1

Delay Time - Propagation: Extremely fast at 2.5ns

Current - Output High, Low: Strong drive with 24mA

Operating Temperature Range: Broad with -40°C to 85°C

Product Advantages

High-speed operation crucial for rapid data handling

Low power consumption suitable for battery-powered devices

Robust output drive current supporting multiple loads

Compatible with a wide range of supply voltages

Key Technical Parameters

Voltage - Supply Range: Versatile with 2V to 6V

Packaging: Supplied in Tape & Reel (TR) for automated assembly

Mounting Type: Surface Mount for compact PCB designs

Package / Case: 20-SOIC standard size for integration

Quality and Safety Features

Compliance with RoHS standards ensuring environmental safety

Manufactured by Texas Instruments, a leader in semiconductor reliability

Compatibility

Direct replacement for other standard 74AC series latches

Compatible with multiple logic families due to broad voltage range

Application Areas

Telecommunication

Computing

Data storage systems

Industrial electronics

Portable electronics

Product Lifecycle

Active status with potential for long-term availability

No indication of nearing discontinuation, ensuring ongoing supply

Several Key Reasons to Choose This Product

Consistent performance, validated through Texas Instruments' rigorous testing procedures

Comprehensive warranty and support from Texas Instruments

Ideal for high-performance logic circuit designs

Flexibility for use in a wide scope of applications due to tri-state outputs

Compatibility with existing and new designs due to standard package and footprint