SN74ABT240ANSR - Texas Instruments

Manufacturer Part Number

SN74ABT240ANSR

Manufacturer

Texas Instruments

Introduction

The SN74ABT240ANSR is a high-performance, integrated circuit designed for logic buffering and driving, part of the 74ABT series, optimized for digital signal processing tasks.

Product Features and Performance

Incorporates two inverting buffers with 4 bits each

Features 3-state outputs for bus interfacing

Supports high-speed data transmission

Ensures low power dissipation

Operates over a supply voltage range of 4.5V to 5.5V

Designed for -40°C to 85°C operating temperature range

Surface mount 20-SOIC package for compact integration

Product Advantages

High current output capability (32mA high, 64mA low) facilitates driving of high-load applications

3-state outputs enable connection to system buses without interference

Enhanced signal integrity thanks to controlled rise and fall times

Compatibility with 5V systems offers a broad usage spectrum

Key Technical Parameters

Logic Type: Buffer, Inverting

Number of Elements: 2

Number of Bits per Element: 4

Output Type: 3-State

Current Output High, Low: 32mA, 64mA

Voltage Supply: 4.5V ~ 5.5V

Operating Temperature: -40°C ~ 85°C

Quality and Safety Features

Manufactured by Texas Instruments, a leader in semiconductor solutions

Complies with stringent quality standards for reliability

Compatibility

Interoperable with digital systems requiring high-speed data buffering

Application Areas

Telecommunications

Computing

Data storage systems

Digital signal processing

Product Lifecycle

Product Status: Active, ensuring ongoing manufacture and support

Not marked for discontinuation, with availability of replacements and upgrades

Several Key Reasons to Choose This Product

High reliability and performance for critical digital applications

Suitable for a wide range of high-speed digital interfacing needs

Texas Instruments’ commitment to quality and support

Extended temperature range for challenging environments

Easy integration into existing systems with surface mount packaging