Manufacturer Part Number
SN65LVCP40RGZ
Manufacturer
Texas Instruments
Introduction
The SN65LVCP40RGZ is a highly integrated signal conditioning buffer and multiplexer designed for high-speed LVDS signal processing.
Product Features and Performance
Supports LVDS applications.
Capable of input signal conditioning with CML, LVDS, LVPECL inputs.
Outputs VML signal type.
Maximum data rate of 4Gbps.
Features 2 x 1:2 channel configuration.
Very low delay time of 0.5ns ensuring minimal signal lag.
Incorporates input equalization and output pre-emphasis for optimized signal integrity.
Operates with a supply voltage between 3.135V and 3.465V.
Designed for surface mount technology with a 48-VFQFN exposed pad package.
Product Advantages
High-speed data processing capability.
Enhanced signal integrity through advanced conditioning features.
Minimal delay enhances real-time performance.
Versatility with various input signal compatibility.
Compact form factor suitable for densely packed PCB designs.
Key Technical Parameters
Data Rate (Max): 4Gbps.
Number of Channels: 2 x 1:2.
Delay Time: 0.5ns.
Voltage Supply: 3.135V ~ 3.465V.
Operating Temperature: -40°C ~ 85°C.
Package: 48-VFQFN Exposed Pad.
Quality and Safety Features
Operates reliably within a wide temperature range.
Manufactured by Texas Instruments, ensuring high-quality standards and reliability.
Compatibility
Compatible with a wide range of LVDS applications.
Input compatibility with CML, LVDS, LVPECL signals.
Application Areas
High-speed data communication systems.
Signal conditioning in telecommunications.
LVDS interfaces in computing and networking hardware.
Product Lifecycle
Product Status: Last Time Buy.
Note on the availability of replacements or upgrades should be checked with Texas Instruments directly.
Several Key Reasons to Choose This Product
High data rate support up to 4Gbps for demanding applications.
Advanced signal conditioning features enhance signal integrity and performance.
Low delay time is crucial for real-time applications.
Versatile input signal support increases compatibility.
Manufactured by a leader in semiconductor solutions, ensuring reliability and performance.
Compact package design facilitates easier integration into system designs.