PGA309ASPWT - Texas Instruments

Manufacturer Part Number

PGA309ASPWT

Manufacturer

Texas Instruments

Introduction

The PGA309ASPWT is a signal conditioner for sensor and detector interface applications.

Product Features and Performance

Highly integrated analog front-end

Built-in programmable gain amplifier

Supports a wide range of bridge sensors

Configurable voltage and current excitation sources

Internal temperature sensor for thermal compensation

Flexible input and output range settings

Sensor linearization capabilities

Product Advantages

Enhanced signal conditioning for sensor outputs

Precise temperature compensation enhancing accuracy

Low power consumption ideal for portable devices

Robust design suitable for industrial environments

Compatibility with a wide range of sensors improves adaptability

Boosts performance of low-output sensors

Key Technical Parameters

Type: Signal Conditioner

Input Type: Logic

Output Type: Voltage

Current - Supply: 1.2 mA

Operating Temperature Range: -55°C to 150°C

Mounting Type: Surface Mount

Package / Case: 16-TSSOP

Supplier Device Package: 16-TSSOP

Base Product Number: PGA309

Quality and Safety Features

Extended temperature operation for harsh environments

Calibration support to maintain accuracy and reliability

Manufactured by Texas Instruments, a leader in semiconductor quality

Compatibility

Compatible with various sensor outputs in a bridge configuration

Interface connects easily to data acquisition systems

Designed for simple integration with microcontrollers

Application Areas

Industrial control systems

All types of sensor interface applications

Medical equipment monitoring

Automotive sensor systems

Test and measurement setups

Product Lifecycle

Product Status: Active

Long-term availability with no immediate discontinuation

Replacements and upgrades may be available in case of technological advancements

Several Key Reasons to Choose This Product

Long operational life in extreme temperatures from -55°C to 150°C

Simplifies complex signal conditioning tasks for bridge sensors

Provides system designers with a low-power, flexible interface option

Significant reduction in external component needs due to integration

Support from a reputable manufacturer, ensuring technical assistance and reliability