DAC7564ICPW - Texas Instruments

Manufacturer Part Number

DAC7564ICPW

Manufacturer

Texas Instruments

Introduction

The DAC7564ICPW is a low-power, 12-bit, quad digital-to-analog converter (DAC) offering high accuracy and speed with a flexible SPI and DSP compatible interface.

Product Features and Performance

12-bit resolution

Quad-channel DAC

Fast settling time of 10µs

Buffered voltage outputs

SPI and DSP compatible serial interface

Selectable internal or external reference

Product Advantages

High performance with low power consumption

Precision accuracy with INL/DNL of ±0.5, ±0.1 LSB

Multiple reference options for design flexibility

Supports a wide supply voltage range for analog and digital supplies (2.7V to 5.5V)

Key Technical Parameters

Number of Bits: 12

Number of D/A Converters: 4

Settling Time: 10µs

Output Type: Buffered Voltage

Data Interface: SPI, DSP

Reference Type: External, Internal

Supply Voltage Range: 2.7V ~ 5.5V

INL/DNL: ±0.5, ±0.1 LSB

Architecture: String DAC

Quality and Safety Features

Built-in power-on-reset circuit

Thermal shutdown protection feature

Operation within industrial temperature range (-40°C to 105°C)

Compatibility

Standard SPI and DSP interfaces for easy integration with existing digital systems

Surface mountable 16-TSSOP package compatible with standard PCB manufacturing processes

Application Areas

Industrial automation

Process control

Data acquisition systems

Test and measurement equipment

Portable and battery-powered instruments

Product Lifecycle

Active product status

Not indicated as nearing discontinuation

Replacement or upgrades should be sourced from current or future Texas Instruments DAC portfolio

Several Key Reasons to Choose This Product

High-speed, quad-channel DAC enhances performance for multi-channel applications

Excellent power-to-performance ratio for energy-sensitive systems

Robust thermal and power-on-reset features ensure reliable operation over a wide temperature range

Versatility with multiple reference sources reduces the need for additional components

Ease of integration with standardized interfaces and surface-mount packaging for a reduced footprint