Manufacturer Part Number
DAC7564ICPW
Manufacturer
Texas Instruments
Introduction
The DAC7564ICPW is a low-power, 12-bit, quad digital-to-analog converter (DAC) offering high accuracy and speed with a flexible SPI and DSP compatible interface.
Product Features and Performance
12-bit resolution
Quad-channel DAC
Fast settling time of 10µs
Buffered voltage outputs
SPI and DSP compatible serial interface
Selectable internal or external reference
Product Advantages
High performance with low power consumption
Precision accuracy with INL/DNL of ±0.5, ±0.1 LSB
Multiple reference options for design flexibility
Supports a wide supply voltage range for analog and digital supplies (2.7V to 5.5V)
Key Technical Parameters
Number of Bits: 12
Number of D/A Converters: 4
Settling Time: 10µs
Output Type: Buffered Voltage
Data Interface: SPI, DSP
Reference Type: External, Internal
Supply Voltage Range: 2.7V ~ 5.5V
INL/DNL: ±0.5, ±0.1 LSB
Architecture: String DAC
Quality and Safety Features
Built-in power-on-reset circuit
Thermal shutdown protection feature
Operation within industrial temperature range (-40°C to 105°C)
Compatibility
Standard SPI and DSP interfaces for easy integration with existing digital systems
Surface mountable 16-TSSOP package compatible with standard PCB manufacturing processes
Application Areas
Industrial automation
Process control
Data acquisition systems
Test and measurement equipment
Portable and battery-powered instruments
Product Lifecycle
Active product status
Not indicated as nearing discontinuation
Replacement or upgrades should be sourced from current or future Texas Instruments DAC portfolio
Several Key Reasons to Choose This Product
High-speed, quad-channel DAC enhances performance for multi-channel applications
Excellent power-to-performance ratio for energy-sensitive systems
Robust thermal and power-on-reset features ensure reliable operation over a wide temperature range
Versatility with multiple reference sources reduces the need for additional components
Ease of integration with standardized interfaces and surface-mount packaging for a reduced footprint