CLC021AVGZ-5.0 - Texas Instruments

Manufacturer Part Number

CLC021AVGZ-5.0

Manufacturer

Texas Instruments

Introduction

The CLC021AVGZ-5.0 is a high-speed serializer designed for the automotive and industrial markets, facilitating the conversion of parallel data into serial format for easier and more efficient data transmission.

Product Features and Performance

High data rate of up to 400 Mbps

Compatible with HCMOS/LSTTL inputs and provides HCMOS/TTL outputs

Supports 10 inputs to 1 output serialization

Operates on a supply voltage of 4.5V to 5.5V

Designed for automotive applications, meeting the rigorous AEC-Q100 standard

Surface mount technology for compact board designs

Packaged in a 44-QFP, ensuring compact size for space-constrained applications

Product Advantages

High-speed operation facilitates rapid data communication

Automotive grade qualification ensures reliability in harsh environments

Broad compatibility with various input and output standards

Direct support for automotive and industrial applications

Simplifies PCB layout with a compact 44-QFP package

Key Technical Parameters

Data Rate: 400Mbps

Input Type: HCMOS/LSTTL

Output Type: HCMOS/TTL

Number of Inputs: 10

Number of Outputs: 1

Voltage Supply: 4.5V ~ 5.5V

Operating Temperature: 0°C ~ 70°C

Mounting Type: Surface Mount

Package / Case: 44-QFP

Quality and Safety Features

Meets AEC-Q100 standard for automotive quality

Robust operating temperature range from 0°C to 70°C

Compatibility

Compatible with devices that use HCMOS, LSTTL, HCMOS, and TTL signal levels

Application Areas

Automotive systems

Industrial control units

High-speed data communication links

Product Lifecycle

Discontinued at Digi-Key, indicating potential discontinuation or phasing towards end of life

Customers should seek replacements or upgrades for future designs

Several Key Reasons to Choose This Product

High-speed data transmission capability enhances system performance

AEC-Q100 qualification assures quality and reliability for automotive applications

Broad input and output compatibility allows for versatile system integration

Compact packaging supports space-efficient designs in automotive and industrial applications

Support for high operating temperatures increases system robustness in demanding environments