Manufacturer Part Number
CDCM1804RGET
Manufacturer
Texas Instruments
Introduction
CDCM1804RGET is a versatile clock buffer part of the Clock/Timing Clock Buffers, Drivers category, focusing primarily on distributing, dividing, and multiplexing clock signals.
Product Features and Performance
Configurable as Fanout Buffer, Divider, or Multiplexer
Supports multiple input types: CML, HSTL, LVDS, LVPECL, LVTTL, SSTL-2, VML
Capable outputs: LVCMOS, LVPECL
Maximum frequency up to 800 MHz
Operates within a supply voltage range of 3V to 3.6V
Functional across a wide operating temperature range from -40°C to 85°C
Product Advantages
Flexible input and output compatibility supports various signal standards
High frequency support suitable for high-speed applications
Compact 24-VFQFN exposed pad package for space-sensitive applications
Key Technical Parameters
Number of Circuits: 1
Ratio Input:Output: 1:3
Differential Input:Output: Yes/Yes
Frequency Max: 800 MHz
Voltage Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Quality and Safety Features
Manufactured by Texas Instruments, a leader in semiconductor innovation
Surface mount technology enhances reliability and durability in harsh environments
Compatibility
Input compatibility with CML, HSTL, LVDS, LVPECL, LVTTL, SSTL-2, VML
Output compatibility with LVCMOS, LVPECL
Application Areas
Telecommunications
Computing Systems
Signal Processing Devices
High-speed Data Transmission Equipment
Product Lifecycle
Current status: Active
Not reported as nearing discontinuation
Ongoing availability of replacements or upgrades
Several Key Reasons to Choose This Product
Broad compatibility with numerous input and output types allowing for versatile use in different electronic setups
Ability to handle high frequencies up to 800 MHz, supporting high-speed operations
Texas Instruments' reputation for quality and reliability ensures product dependability
Flexible use cases as fanout buffer, divider, or multiplexer to meet various design requirements
Suitable for compact and precision-demanding applications with its small form factor package