Manufacturer Part Number
CD74HC74M96
Manufacturer
Texas Instruments
Introduction
High-Speed CMOS Logic Dual D-Type Flip-Flop with Set and Reset
Product Features and Performance
Dual D-type flip-flops with set and reset functionality
Complementary outputs
Operating frequency up to 50 MHz
Low propagation delay: 30ns at 6V, 50pF
Positive edge-triggered
Balanced output drive: 5.2mA High/Low
Wide operating voltage range: 2V to 6V
Low quiescent current: 4 µA
Input capacitance of 10 pF
High noise immunity
Operation from -55°C to +125°C
Product Advantages
Fast switching speeds suitable for high-speed applications
Stable and reliable performance over a broad voltage range
Efficient power consumption for battery-powered devices
Robust operational temperature range for extreme environments
Suited for automated surface mount assembly
Key Technical Parameters
Number of Elements: 2
Number of Bits per Element: 1
Clock Frequency: 50 MHz
Max Propagation Delay: 30ns
Output Current: 5.2mA
Voltage Supply: 2V to 6V
Quiescent Current: 4 µA
Input Capacitance: 10 pF
Operating Temperature: -55°C to 125°C
Quality and Safety Features
Designed and fabricated under strict industry standards
Provides thermal protection and high stability
Enhanced electrostatic discharge protection
Compatibility
Compatible with TTL levels
Can be integrated into various digital systems with logic-level compatibility
Suitable for use with 14-SOIC footprint on PCBs
Application Areas
Telecommunications
Data processing
Computing devices
Signal processing
Consumer electronics
Industrial control systems
Product Lifecycle
Currently Active
Not near discontinuation
Availability of replacements and upgrades if needed
Several Key Reasons to Choose This Product
High-speed operation aids in efficient data processing
Low power consumption extends battery life for portable devices
Wide operating temperature suitable for industrial applications
Made by Texas Instruments, a reputable manufacturer in semiconductors
Long active product lifecycle ensures availability for ongoing projects
Scalable and adaptable for both simple and complex digital circuits
Ease of integration with established SOIC packaging standards