Manufacturer Part Number
CD4066BM96
Manufacturer
Texas Instruments
Introduction
The CD4066BM96 is an integrated circuit featuring four independently selectable switches, commonly used for signal routing in analog and digital applications.
Product Features and Performance
Four SPST switches
Low on-state resistance of 240Ohm
Channel-to-Channel Matching of 5Ohm
Wide supply voltage range: 3V to 18V
High off-mode signal noise rejection
Fast switching speed
40MHz -3db bandwidth ensuring good frequency response
Low channel capacitance of 8pF
Product Advantages
Versatility in handling analog and digital signals
Low power consumption
Reliable in a wide range of operating conditions
Minimized signal distortion due to low on-state resistance
Key Technical Parameters
SPST switch circuit
Multiplexer/Demultiplexer Circuit 1:1
4 independent circuits
On-State Resistance (Max): 240Ohm
Voltage Supply (Single): 3V ~ 18V
Operating Temperature Range: -55°C ~ 125°C
14-SOIC Package
Quality and Safety Features
Compliant with industry standard safety and quality norms
Over-temperature and over-voltage protection features
Rigorous testing to ensure reliability across the full operating temperature range
Compatibility
Compatible with various logic families due to its wide operating voltage range
Industry-standard 14-SOIC packaging for compatibility with standard surface-mount technology
Application Areas
Communication systems
Data acquisition systems
Control systems
Signal processing
Product Lifecycle
The product status is active
No indication of near discontinuation
Availability of replacements or upgrades not specified but generally supported by Texas Instruments
Several Key Reasons to Choose This Product
High reliability from a respected manufacturer, Texas Instruments
Flexible usage across a wide voltage range accommodating various applications
Low signal distortion properties improve system performance
Capable of operating in extreme temperature conditions, suitable for harsh environments
Easy to integrate into designs due to standard packaging and footprint
Prolonged product lifecycle with active status minimizes redesign costs