CC1150RGVR - Texas Instruments

Manufacturer Part Number

CC1150RGVR

Manufacturer

Texas Instruments

Introduction

The CC1150RGVR is a highly integrated, low-power, RF transmitter chip from Texas Instruments. It is designed for use in various wireless communication applications, particularly in the sub-1GHz frequency range.

Product Features and Performance

Operates in the 300MHz ~ 348MHz, 400MHz ~ 464MHz, and 800MHz ~ 928MHz frequency bands

Supports data rates up to 500kBaud

Provides a maximum output power of 10dBm

Consumes only 29mA of current during transmission

Supports various modulation schemes, including UHF

Integrates a complete RF transmitter, including an oscillator, mixer, and power amplifier

Offers a versatile SPI data interface

Product Advantages

Highly integrated design reduces the need for external components

Low power consumption optimizes battery life in portable applications

Wide frequency range and flexible modulation support enable use in diverse wireless applications

Small 16-VQFN package with exposed pad for efficient heat dissipation

Key Technical Parameters

Frequency range: 300MHz ~ 348MHz, 400MHz ~ 464MHz, 800MHz ~ 928MHz

Operating temperature: -40°C ~ 85°C

Supply voltage: 1.8V ~ 3.6V

Transmit current: 29mA

Data rate: Up to 500kBaud

Quality and Safety Features

RoHS3 compliant for environmental safety

Tested and certified to meet industry standards

Compatibility

Compatible with a wide range of wireless communication protocols and standards

Application Areas

Suitable for general-purpose wireless applications, such as remote controls, wireless sensor networks, and industrial automation

Product Lifecycle

The CC1150RGVR is an active product with no indication of discontinuation

Replacements and upgrades may be available from Texas Instruments as technology advances

Key Reasons to Choose This Product

Proven performance and reliability from a leading semiconductor manufacturer

Highly integrated design for reduced system complexity and cost

Low power consumption for extended battery life in portable applications

Flexible frequency range and modulation support for diverse wireless use cases

Small package size and thermal management capabilities for efficient integration